Organoplastics have recently become widely used in aeronautical engineering as structural materials and means of protecting critical units (engines, control systems) from damaging factors due to their lightness and strength. The microstructure of the samples of the aramid fabric TSVM-J, subjected to a microwave-frequency electromagnetic field of an average power level at a frequency of 2450 MHz was investigated. A significant change in the contact conditions of individual filaments at the level of interfibril bonding of fibers has been found, which is expressed in the aggregation of fibrils into agglomerates filling the gaps between the fibers with increasing interaction area and in the convergence of individual fibers, which increases the reliability of intermolecular bonds. The obtained results can be used as one of the mechanisms for increasing the strength characteristics of structural organoplastics and protective materials from aramid tissues after microwave exposure.